With today’s delicate and complex electronic assemblies, temperature accuracy is a consistent challenge. Component density, lead size and thermally sensitive components all combine to increase process control demands, criteria which many systems fail to meet.

Thermaltronics CHT (Curie Heat Technology) is different, it responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material.

 

Figure 5. Illustration of the Curie point heating process.

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